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A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers-中国光学期刊网
Electronic Supporting Information Novel laser-assisted glass frit encapsulation for long-lifetime perovskite solar cells
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Figure 3 from Wafer-Level Vacuum Packaging for Microsystems Using Glass Frit Bonding | Semantic Scholar
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